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AS1106, AS1107
Datasheet - A p p l i c a t i o n I n f o r m a t i o n
Table 23. R SET vs. Segment Current and LED Forward Voltage, V DD = 5.0V
I SEG (mA)
40
30
20
10
1.5
11.35k Ω
15.4k Ω
23.6k Ω
48.9k Ω
2.0
11.12k Ω
15.1k Ω
23.1k Ω
47.8k Ω
2.5
10.84k Ω
14.7k Ω
22.6k Ω
46.9k Ω
V LED (V)
3.0
10.49k Ω
14.4k Ω
22k Ω
45.4k Ω
3.5
10.2k Ω
13.6k Ω
21.1k Ω
43.8k Ω
4.0
9.9k Ω
13.1k Ω
20.2k Ω
42k Ω
9.3 Calculating the Power Dissipation
The upper limit for power dissipation (PD) for the AS1106/AS1107 is determined from the following equation:
PD = (V DD x 1mA) + (V DD - V LED )(DUTY x I SEG x N)
Where:
V DD is the supply voltage.
DUTY is the duty cycle set by intensity register (page 12).
N is the number of segments driven (worst case is 8)
V LED is the LED forward voltage
I SEG = segment current set by RSET
Dissipation Example:
I SEG = 40mA, N = 8, DUTY = 31/32, V LED = 1.8V at 40mA, V DD = 5.25V
PD = 5.25V(1mA) + (5.25V - 1.8V)(31/32 x 40mA x 8) = 1.075W
Thus, for a PDIP package Θ JA = +75°C/W (from Table 24 ), the maximum allowed T AMB is given by:
T J,MAX = T AMB + PD x Θ JA = 150°C = T AMB +1.07W x 75°C/W
Where:
T AMB = +69.4°C.
The T AMB limit for SO Packages in the dissipation example above is +58.6°C.
Table 24. Package Thermal Data
(EQ 1)
(EQ 2)
(EQ 3)
(EQ 4)
Package
24 Narrow DIP
24 Wide SOIC
Thermal Resistance ( Θ JA )
+75°C/W
+85°C/W
www.austriamicrosystems.com/LED-Driver-ICs/AS1106_07
Revision 2.28
15 - 21
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